Heat sealing film | HM30 |
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HM type is a heat seal film with two functions. Since it has both function of simple hot melt bonding and function of heat curing type bonding, it is possible to select and use any bonding conditions in order to meet required characteristics.
Adherend | Adhesive strength (N/cm) | Solder dip resistance(210℃×30sec) | ||
---|---|---|---|---|
After lamination, heating at 120 ℃ | After 120℃ lamination and 150℃×2hr curing | No curing | After 150℃×2hr curing | |
PET | 11.1 | 13.7 | × | ○ |
SUS | 11.2 | 14.8 | × | ○ |
Aluminum foil | 7.2 | 11.7 | × | ○ |
Copper foil | 12.4 | 15.6 | × | ○ |
PI | 7.0 | 9.0 | × | ○ |